Description: Chemical-mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses : Fundamental Mechanisms and Application to Ic Interconnect Technology, Paperback by Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J., ISBN 1461354242, ISBN-13 9781461354246, Brand New, Free shipping in the US As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
Price: 186.59 USD
Location: Jessup, Maryland
End Time: 2025-01-25T06:14:00.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 14 Days
Refund will be given as: Money Back
Return policy details:
Book Title: Chemical-mechanical Polishing of Low Dielectric Constant Polymers
Number of Pages: Xiv, 229 Pages
Language: English
Publication Name: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses : Fundamental Mechanisms and Application to IC Interconnect Technology
Publisher: Springer
Publication Year: 2014
Subject: Electronics / Semiconductors, Chemistry / Physical & Theoretical, Electrical, Manufacturing, Industrial Technology
Item Weight: 13.6 Oz
Type: Textbook
Item Length: 9.3 in
Author: William N. Gill, Ronald J. Gutmann, Christopher Lyle Borst
Subject Area: Technology & Engineering, Science
Item Width: 6.1 in
Format: Trade Paperback
