Description: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses by Ronald J. Gutmann, Christopher Lyle Borst, William N. Gill Estimated delivery 3-12 business days Format Paperback Condition Brand New Description As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. Publisher Description As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. Details ISBN 1461354242 ISBN-13 9781461354246 Title Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Author Ronald J. Gutmann, Christopher Lyle Borst, William N. Gill Format Paperback Year 2014 Pages 229 Edition 02200th Publisher Springer-Verlag New York Inc. GE_Item_ID:137568476; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys
Price: 189.14 USD
Location: Fairfield, Ohio
End Time: 2025-01-24T03:12:02.000Z
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Restocking Fee: No
Return shipping will be paid by: Buyer
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Refund will be given as: Money Back
ISBN-13: 9781461354246
Book Title: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers
Number of Pages: Xiv, 229 Pages
Language: English
Publication Name: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses : Fundamental Mechanisms and Application to IC Interconnect Technology
Publisher: Springer
Publication Year: 2014
Subject: Electronics / Semiconductors, Chemistry / Physical & Theoretical, Electrical, Manufacturing, Industrial Technology
Item Weight: 13.6 Oz
Type: Textbook
Item Length: 9.3 in
Author: William N. Gill, Ronald J. Gutmann, Christopher Lyle Borst
Subject Area: Technology & Engineering, Science
Item Width: 6.1 in
Format: Trade Paperback